NTCC200E4, NTCC300E4 www.vishay.com Vishay BCcomponents Leadless NTC Thermistor Die Suitable for Wire Bonding FEATURES * Flat chip contacted top and bottom (gold: NTCC300E4 series or silver: NTCC200E4 series) * Green thermistor - does not use RoHS exemptions * Wide temperature range from -55 C to +175 C * Highly resistant to thermal shocks * Ideal for wire bonding (aluminum or gold depending on metalization type) * Resistance to leaching * Delivered on blister tape * AEC-Q200 qualified * Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 QUICK REFERENCE DATA PARAMETER VALUE UNIT 4.7K to 20K 1; 2; 3; 5 % 3435 to 3865 K 1 % Operating temperature range -55 to +175 C Response time (63.2 %) 25 C to 85 C still air (for info) 3 s Dissipation factor in still air (for info, non-mounted die) 3 mW DESIGN-IN SUPPORT Maximum power dissipation 50 mW For complete curve computation, please visit: www.vishay.com/thermistors/ntc-curve-list/ Weight 3 mg Resistance value at 25 C Tolerance on R25-value B25/85-value Tolerance on B25/85-value APPLICATIONS * High temperature sensing, control and compensation. E.g. IGBT modules (inverters in EV and HEV vehicles) * IC and semiconductor protecting * DC/AC power inverters and HIC overheat protecting MARKING The thermistors have no marking and have electrode termination design without orientation. MOUNTING The thermistors are primarily intended for wire bonding. The parameters of the assembly process should be chosen in accordance with the lead-wire material. The mounting process should be in compliance with the following guidelines and recommendations: Die bonding: * Gold electrode: silver epoxy gluing. * Silver electrode: (vacuum) reflow soldering - silver epoxy gluing - nano silver sintering. Cleaning: * Detergent spraying. * Ultrasonic or formic acid vapor cleaning is not recommended. Wire bonding: * The gold electrode has been tested for gold wire bonding with a wire diameter of max. 32 m. * The silver electrode has been tested for aluminum wire bonding with a wire diameter of max. 300 m. Encapsulation: * In order to preserve the characteristics of the bonded die at long term an encapsulation is mandatory. * The encapsulation is defined by the user. Silicon and epoxy encapsulations have been tested. For recommendations on compatible encapsulants contact Vishay. ELECTRICAL DATA AND ORDERING INFORMATION R25 () R25-TOL. ( %) B25/85 (K) B25/85-TOL. ( %) DESCRIPTION SAP MATERIAL AND ORDERING NUMBER (1) 4700 1, 2, 3, 5 3435 1 Bare die with top / bottom silver terminations NTCC200E4472*T 12 000 1, 2, 3, 5 3740 1 Bare die with top / bottom silver terminations NTCC200E4123*T 20 000 1, 2, 3, 5 3865 1 Bare die with top / bottom silver terminations NTCC200E4203*T 4700 1, 2, 3, 5 3435 1 Bare die with top / bottom gold terminations NTCC300E4472*T 12 000 1, 2, 3, 5 3740 1 Bare die with top / bottom gold terminations NTCC300E4123*T 20 000 1, 2, 3, 5 3865 1 Bare die with top / bottom gold terminations NTCC300E4203*T Note (1) In order to define R -tolerance, replace * in SAP part number by F ( 1 %), G ( 2 %), H ( 3 %), or J ( 5 %) 25 Revision: 20-Jul-2018 Document Number: 29153 1 For technical questions, contact: nlr@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 NTCC200E4, NTCC300E4 www.vishay.com Vishay BCcomponents DIMENSIONS in millimeters W T Wire bondable surface PARAMETER VALUE W 2 0.1 T 0.7 max. Note * Non-dimensioned details do not affect the performance of the thermistors PACKAGING The components are delivered on 8mm embossed blister tape (0.3 mm conductive PS) conforming to EIA-481 and IEC 60286-3, with 2000 parts per reel. Revision: 20-Jul-2018 PARAMETER VALUE A0 2.2 0.1 B0 2.2 0.1 K0 1.0 0.1 W 8 0.3 F 3.5 0.05 E1 1.75 0.1 P0 4.0 0.1 P2 2.0 0.05 D0 1.5 0.1 D1 1.0 0.1 T 0.35 max. T2 0.50 max. Document Number: 29153 2 For technical questions, contact: nlr@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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